All-in-One MMS Pricing
Workstation Standard
Lightweight and efficient AI solution.
Use Cases
AI idea validation for developers
Lightweight knowledge bases for SMEs
Core Advantages
Ultimate Efficiency
Cost-Effectiveness
Rapid Deployment
SuperX Multi-Model AI Platform
Multi-Model fusion architecture
Cloud-Coordinated Model Caching
Enterprise-grade knowledge base system
Scenario-based agents
Technical Specifications
1-2x NVIDIA GeForce RTX 5090 Graphics Card, 32GB GDDR7 VRAM
Intel® Core™ i9-14900KF 24-Core, 32-thread
2x 32GB 5200 MT/s DDR5
1TB M.2 NVMe SSD
Workstation Ultra
High-performance, real-time collaborative AI platform.
Use Cases
Online customer service
Real-time tasks
Interactive data analysis
Core Advantages
Outstanding Performance
Real-Time Capabilities
Team Collaboration
SuperX Multi-Model AI Platform
Multi-Model fusion architecture
Cloud-Coordinated Model Caching
Enterprise-grade knowledge base system
Scenario-based agents
Enterprise-Grade Privacy
Technical Specifications
4x NVIDIA GeForce RTX 5090 Graphics Card, 32GB GDDR7 VRAM
AMD Ryzen Threadripper, 24-Core, 48-thread
128GB 4800MHz DDR5
2TB NVMe SSD
B200 Standard
Enterprise-grade, full-scale secure AI solution.
Use Cases
Enterprise applications with high concurrency needs
R&D and production environments with multiple users
Core Advantages
Peak Performance
Enterprise-Grade Security
Scalability
SuperX Multi-Model AI Platform
Multi-Model fusion architecture
Cloud-Coordinated Model Caching
Enterprise-grade knowledge base system
Scenario-based agents
Enterprise-Grade Privacy
Technical Specifications
8x NVIDIA Blackwell B200, 192GB HBM3e VRAM
2x Intel® Xeon Gold 6710E 64-Core, 64-thread
3072GB DDR5 RDIMM
15.36TB NVMe SSD
AI Server Pricing
B300
Engineered for extreme AI and HPC performance, providing advanced networking, scalability, and energy efficiency in mission-critical data center environments.
Key Specifications
Intel Xeon 6 Processors; Intel Xeon 6700-Series; Intel Xeon 6500-Series; Dual processor, TDP up to 350W
8-Channel DDR5 RDIMM/MRDIMM, 32 × DIMMs; RDIMM up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM up to 8000 MT/s (Xeon 6 P-cores, 1DPC only)
8 × 2.5″ Gen5 NVMe hot-swap; 2 × M.2 (PCIe Gen5 x4/x2, 2280/22110)
B200
10U AI Inference Server powered by NVIDIA HGX B200.
Key Specifications
NVIDIA HGX™ B200 with 8 x SXM GPUs
Intel® Xeon® 6 Processors Intel® Xeon® 6700-Series Processors Intel® Xeon® 6500-Series Processors · Dual processor, TDP up to 350W
32 x DIMM slots · DDR5 memory supported · 8-channel memory per processor · RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC) · MRDIMM: Up to 8000 MT/s
Front hot-swap: 8x2.5" Gen5 NVMe (NVMe from PEX89104) Internal M.2: 1xM.2(2280/22110), PCIe Gen5 x 4, from CPU 1 · 1xM.2(2280/22110), PCIe Gen5 x 2, from CPU 1
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